Coordination of the European software-defined vehicle platform

Code: 40834 | Identifier Code: HORIZON-JU-CHIPS-2026-SDV-CSA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 22/09/2026

Modern ECS are a highly complex combination of hardware and software components that exhibit intricate configurations, dependability constraints and interoperability needs. European vehicle manufacturers and suppliers are at risk of losing their competitive edge compared to their International counterparts, who are innovating at higher speed and scale.

Supply chain resilience CSA

Code: 40831 | Identifier Code: HORIZON-JU-CHIPS-2026-2-CSA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 22/09/2026

The action supports the data gathering from companies (potentially leveraging API based surveys and automated tools such as web crawling to gather publicly available information), providing them with the respective incentives to participate. Data should include both public and restricted industry data. The public data can be used to create an online catalogue of companies, products, and services in the European semiconductor supply chain.

RIA Resilience call reinforcing Europe's strength in 6G radio communication systems

Code: 40827 | Identifier Code: HORIZON-JU-CHIPS-2026-2-RIA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals submitted to this call should address the following set of FEM constituent technologies in priority including challenges issues such as:

• Transmitter and Power amplification
• Receiver
• TRX
• Integration/packaging
• Sustainability
• Advanced Antenna System
• ISAC

IA Resilience call reinforcing Europe's strenght in health

Code: 40824 | Identifier Code: HORIZON-JU-CHIPS-2026-FT3-IA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Integrated technologies for monitoring, imaging and biomedical research:

• Advanced wearable health technologies and integrated solutions
• Personalized imaging technologies
• Advanced laboratory and scientific solutions

Impact Monitoring and Assessment Framework for the Chips JU

Code: 40821 | Identifier Code: HORIZON-JU-CHIPS-2026-IMAF-CSA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 30/09/2026

Projects funded under this call are expected to deliver the following outcomes, which together constitute a complete and durable impact monitoring and assessment framework:

• Complete Indicator Framework: A validated indicator framework of short-term actions, outcomes and long-term impacts, for both the ECS programme and the Chips for Europe Initiative, integrating Horizon Europe indicators, common JU indicators, and Chips JU-specific indicators.
• Data Collection and Exploitation Monitoring Platform: A standardised, multi-user platform for the systematic collection of programme-level monitoring data from all Chips JU projects and key external stakeholders, covering both the periodic tracking of programme indicators and the continuous monitoring of exploitation and commercialisation progress across all active and recently closed projects.
• Scalable Impact Assessment Methodology: A documented, scalable and auditable methodology for conducting structured periodic impact assessments of the full Chips JU programme, providing the analytical framework for interpreting programme monitoring data and producing credible, comparable and externally auditable assessments of programme performance across all relevant impact dimensions.
• Governance Architecture and Operational Handover: A governance architecture for the IMAF defining the roles, responsibilities, oversight mechanisms and data management protocols that ensure the infrastructure operates with appropriate independence, credibility and institutional continuity. This shall include a full operational handover to the Chips JU office at action end.

IA Resilience call reinforcing Europe's strength in photonics

Code: 40817 | Identifier Code: HORIZON-JU-CHIPS-2026-FT2-IA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals submitted to this call are expected to address several of the following elements:

• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.

• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.

• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.

• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.

• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

Call with Digital Partnership and TTC countries

Code: 40814 | Identifier Code: HORIZON-JU-CHIPS-2026-3-RIA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies.

IA Resilience call reinforcing Europe's strenght in power electronics

Code: 40811 | Identifier Code: HORIZON-JU-CHIPS-2026-FT1-IA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals innovations should address one or more of the several domains :

• WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions.
• WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain.
• A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes.
• Next generation or optimised new power semiconductor devices fitting their application.
• Adding intelligence to power semiconductor devices on control and/or sensor side.
• Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging.
• Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption.
• Advanced characterization techniques for new materials, devices, and systems.
• Implement AI at system level and/or make use of AI methods to increase the innovation speed.

AI chip demonstrators for EU compute infrastructure

Code: 40808 | Identifier Code: DIGITAL-JU-CHIPS-2026-AI1-SG | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 23/09/2026

The expected outcomes of this topic are :

• Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners.
• Validation of AI chip solutions on a common EU evaluation platform (provided by the Topic X.B consortium), delivering comparative evidence on key performance indicators.
• A shortlist of European AI chip solutions awarded the AI Compute Excellence label and qualified to proceed to full rack development under Topic X.A2.

AI compute evaluation and deployment platform for EU infrastructure

Code: 40805 | Identifier Code: DIGITAL-JU-CHIPS-2026-AI-GFP | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 23/09/2026

The expected outcomes of this topic are :

• A common EU evaluation platform for AI chips and racks, with transparent KPIs, workloads and benchmark reports used for Chips JU selection and procurement decisions.
• First pilot deployments of European AI compute systems validated for EU sovereign partitions of AI infrastructure.
• Structured collaboration between buyers and suppliers, supporting deployment, integration and optimisation of European AI compute solutions.
• Stronger EU demand for European AI chips and racks, helping to create a market for deployment-ready solutions.
• Increased EU technological sovereignty across the AI compute stack for European datacentres.

Stimulation of Chip Design

Code: 40802 | Identifier Code: DIGITAL-JU-CHIPS-2026-SKILLS-SCD-CSA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs.

At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.

Skills Hubs of Excellence

Code: 40799 | Identifier Code: DIGITAL-JU-CHIPS-2026-SKILLS-HOE-SG | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

This call funds the creation of specialised academic “Hubs of Excellence” in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.

Pilot Federation

Code: 40795 | Identifier Code: DIGITAL-JU-CHIPS-2026-SKILLS-PF-SG | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

This call supports the establishment of a European-level federation of Vocational Education and Training (VET) providers focused on semiconductor industry roles.

Projects should develop industry-aligned micro-credentials and reskilling programmes, with a strong emphasis on workers transitioning from other industrial sectors and on cross-border recognition of qualifications.

International collaboration EU and Japan on semiconductors

Code: 40792 | Identifier Code: DIGITAL-JU-CHIPS-2026-SG-JAPAN | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

The scope includes, but is not limited to, the following areas:

• Develop methods for 2.5D/3D integration and integrated photonics processes, chiplet co-optimization, interface design, including through-silicon vias, interposers, and bonding techniques.
• Engage material scientists, chemical engineers, semiconductor manufacturers, and AI experts to bridge research and industrial applications, supporting broad adoption and commercial viability.

Proposals should encourage partnerships across industry, academia, and research organizations to foster breakthroughs in semiconductor manufacturing and contribute to advancing global semiconductor standards

RIA Global call according to SRIA 2026

Code: 39833 | Identifier Code: HORIZON-JU-CHIPS-2026-1-RIA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 03/02/2026 | End submission calls: 07/05/2026

Chips JU Research and Innovation Action (RIA) primarily consists of activities aiming to establish new knowledge and/or to explore the feasibility of a new or improved technology, product, process, service, method, tool or solution. For this purpose, they may include applied research, technology development and/or method/tool and integration, testing and validation on a small-scale prototype in a laboratory or simulated environment.

The activities have their centre of gravity at TRL 3-4.A RIA proposal is characterised by:

• Execution by a consortium that may consist of SMEs, large enterprises, universities, institutes, public organizations;•Developing innovative technologies and/or using them in innovative ways;
• Targeting demonstration of the innovative approach in a relevant product, service or capability, clearly addressing the applications relevant for societal challenges;
• Demonstrating value and potential in a realistic lab environment reproducing the targeted application;
• Having a deployment plan showing the valorisation for the Chips JU ecosystem and the contribution to the Chips JU goals and objectives.

IA Global call according to SRIA 2026

Code: 39830 | Identifier Code: HORIZON-JU-CHIPS-2026-1-IA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 03/02/2026 | End submission calls: 07/05/2026

The activities should have their centre of gravity at the TRL 5-8. An IA proposal in Chips JU is characterized by one or more of the following:

• Execution by an industrial consortium that may consist of large enterprises and SMEs but also including universities, institutes, public organizations.
• Using innovative technology-Establishment of a new and realistic innovation environment connected with an industrial environment, such as:
  • a pilot line facility capable of manufacturing
  • a zone of full-scale testing
  • a development of new processes or tools and their introduction in several domains
  • the development of frameworks or platforms together with the usage of these frameworks or platforms in innovative products.-Having a deployment plan leading to short to midterm economic value creation in Europe.

Lab to Fab Accelerators for Advanced Packaging and heterogeneous integration

Code: 38732 | Identifier Code: DIGITAL-JU-Chips-2025-SG-LFA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 03/12/2025 | End submission calls: 25/02/2026

The Lab-to-Fab Transfer Accelerator (LFA) projects prepare for a faster take-up of latest packaging technologies by the European industry. They do not cover the full lab-to-fab trajectory but prepare it and should enable a seamless fab technology transfer to industry after the end of the project.

advanced packaging of chiplets and heterogeneous integration in Europe

Code: 38729 | Identifier Code: DIGITAL-JU-Chips-2025-CSA-LFA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 03/12/2025 | End submission calls: 25/02/2026

This coordination and support action will support the Lab to Fab Transfer Accelerator (LFA) projects to leverage synergies and standardisation efforts, maximising the efficiency of joint deployment and speeding up future transfer into industrial applications.

It will help to close gaps in advanced packaging capabilities in Europe and contribute to building a stronger European ecosystem.

Boosting R&I cooperation between EU and Japan on semiconductors (CSA)

Code: 37403 | Identifier Code: HORIZON-JU-CHIPS-2025-CSA-JPN | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 08/07/2025 | End submission calls: 17/09/2025

The proposal should promote coordination between EU and Japan on life cycle assessment (LCA) in semiconductor manufacturing, support joint research and innovation (R&I) efforts, and explore future collaboration topics. It should also look into funding talent exchanges, enhance cooperation with Japanese research institutions on digital technologies, and support joint actions to strengthen the semiconductor supply chain.

Digital Europe Programme - Low-power Edge AI Chips

Code: 37400 | Identifier Code: DIGITAL-JU-CHIPS-2025-IA-LEAI | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 08/07/2025 | End submission calls: 17/09/2025

Digital Europe Programme - Set-up and integration of Design Enablement Teams

Code: 36748 | Identifier Code: DIGITAL-JU-CHIPS-2025-CSA-DET | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 04/06/2025 | End submission calls: 30/07/2025

The design platform will focus on empowering emerging companies in the industry, providing them with access to an integrated chip design ecosystem, from early stages to final production.

Heterogeneous Integration for High-Performance Automotive Computing

Code: 36087 | Identifier Code: HORIZON-JU-CHIPS-2025-IA-HPA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 04/03/2025 | End submission calls: 29/04/2025

The Chips JU has in the last couple of years supported several projects on heterogenous integration. The present call is, amongst other objectives, also meant to translate the results of those previous calls into process workflows (TRL 7-8). Implementation of the developed workflows will be integrated in the call on RISC-V hardware platform. This will require a close collaboration between the two consortia that will be enforced when preparing the grants.

Open-source EDA tools development

Code: 36083 | Identifier Code: HORIZON-JU-CHIPS-2025-IA-EDA-two-stage | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 04/03/2025 | End submission calls: 17/09/2025

A key objective of the Chips Act under the Chips for Europe Initiative is the ‘building up of advanced design capacity for integrated semiconductor technologies’.Τhe Initiative shall integrate ‘new design facilities with extended libraries and electronic design automation (EDA) tools’ into a virtual design platform, that will make available a number of open-source tools. Chip design is a vital element in the semiconductor value chain and open-source Electronic Design Automation (EDA) tools can be key drivers for innovation in this sector by enabling researchers and developers to experiment with new algorithms, architectures, and methodologies.

A Pan-European infrastructure for Chips Design Innovation

Code: 36041 | Identifier Code: HORIZON-JU-CHIPS-2025-CSA-1 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 04/03/2025 | End submission calls: 29/04/2025

This call relates to the second general objective of the Chips JU: “Build Up Large-Scale Design Capacities for Integrated Semiconductor Technologies”; and the seventh objective: “Foster a Dynamic Union-Wide Ecosystem Based on Digital Value Chains with Simplified Access to Newcomers”, including the active involvement of Academia, RTOs, and SMEs. This call aims at supporting the follow-up, extension and consolidation of EUROPRACTICE services to provide Europe with an open-access platform to design and fabricate chips.

Global RIA Call

Code: 36031 | Identifier Code: HORIZON-JU-CHIPS-2025-RIA-two-stage | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 04/03/2025 | End submission calls: 17/09/2025

A Chips JU Research and Innovation Action (RIA) primarily consists of activities aiming to establish new knowledge and/or to explore the feasibility of a new or improved technology, product, process, service, method, tool or solution.

Call for establishing Framework Partnership Agreements for developing Quantum Chip Technology for stability Pilot Lines

Code: 35037 | Identifier Code: HORIZON-JU-Chips-FPA-QAC-1 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 24/09/2024 | End submission calls: 21/01/2025

The aim is to support two or more pilot lines implemented through a Framework Partnership Agreement establishing stable and structured long term partnerships between the Chips JU and consortia of industry, research organisations and the institutions in quantum technologies who commit themselves to establishing, coordinating and implementing a strategic and ambitious R&I initiative for the development of innovative quantum chips, followed by an ambitious action for building and deploying pilot lines.

Call for establishing Framework Partnership Agreement(s) for developing Quantum Chip Technology for high quality Trapped Ions Pilot Lines

Code: 35035 | Identifier Code: HORIZON-JU-Chips-FPA-QAC-2 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 24/09/2024 | End submission calls: 21/01/2025

This call aims to develop a scalable production infrastructure for trapped-ion quantum computing processors in Europe, transitioning from manually fabricated ion traps to automated manufacturing processes. The aim is to support one pilot line implemented through a Framework Partnership Agreement establishing a stable and structured long term partnerships between the Chips JU and consortia of industry, research organisations and the institutions in Quantum Technologies who commit themselves to establishing, coordinating and implementing a strategic and ambitious R&I initiative contributing to the development of innovative quantum chips, followed by an ambitious action for building and deploying pilot lines.

Design Platform

Code: 34605 | Identifier Code: DIGITAL-Chips-2024-CSA-CDP-1 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 13/08/2024 | End submission calls: 10/10/2024

This activity aims at building a pioneering cloud-enabled European Design Platform that will aid users, particularly start-ups and SMEs, in accessing a wide range of advanced tools, assets and services to develop their chips. The Design Platform is expected to support the design of a wide variety of technologies, specifically but not limited to digital circuits at multiple process nodes (up to leading edge nodes); analogue; mixed-signal; power; photonics and quantum. The Design Platform shall also support back-end of line (BEOL) design and manufacturing through advanced heterogeneous systems integration and advanced packaging techniques.

Chips Joint Undertaking (Chips JU) Initiative Calls 2024

Code: 34400 | Identifier Code: DIGITAL-Chips-2024-SG-CPL-5 / HORIZON-Chips-2024-RIA-CPL-5 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 25/07/2024 | End submission calls: 17/09/2024

Under the Multi-annual Work Programme 2023-2027 (WP2023-2027) of the Chips Joint Undertaking (‘Initiative’), calls for Pilot Lines (CPL) have opened for the submission of proposals.

Each Call for Pilot Line includes three interrelated calls:

• A Call for Expression of Interest for the selection of a Hosting Consortium.
• A Call for proposals for Set-up, integration and process development, funded under the Horizon Europe Programme.
• A Call for proposals for the operational activities of the pilot line, funded under the Digital Europe Programme.

Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies for future semiconductor components and systems

Code: 32585 | Identifier Code: HORIZON-JU-Chips-2024-3-RIA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 06/02/2024 | End submission calls: 14/05/2024

This call includes one topic for RIA and will be implemented as a one-phase call without national contribution but in cooperation with South Korea.

HORIZON-JU-Chips-2024-1-IA

Code: 32562 | Identifier Code: HORIZON-JU-Chips-2024-1-IA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 09/02/2024 | End submission calls: 17/09/2024

The 3 topics that opened for the submission of proposals are the following:

• Global call according to SRIA 2024
• Focus topic on “High Performance RISC-V Automotive Processors supporting SDV”
• Focus topic on “Service Oriented Framework for the Software Defined Vehicle of the future”

Chips Joint-Undertaking - HORIZON-JU-Chips-2024-2-RIA

Code: 32558 | Identifier Code: HORIZON-JU-Chips-2024-2-RIA | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 09/02/2024 | End submission calls: 17/09/2024

The 2 topics that opened for the submission of proposals are the following:

• Global call according to SRIA 2023 (RIA)
• Focus topic on “Sustainable and greener manufacturing”

Chips Joint Undertaking (Chips JU) Initiative Calls 2023

Code: 32554 | Identifier Code: Initiative Calls 2023 | Programme name: Chips Joint Undertaking (Chips JU) | Start submission calls: 09/02/2024 | End submission calls: 29/02/2024

Each Call for Pilot Line includes three interrelated calls:

• A Call for Expression of Interest for the selection of a Hosting Consortium.
• A Call for proposals for Set-up, integration and process development, funded under the Horizon Europe Programme.
• A Call for proposals for the operational activities of the pilot line, funded under the Digital Europe Programme.

The same application is submitted to those calls and the evaluation will consist of the simultaneous evaluation of the interrelated calls. A consortium will only be eligible for funding if its proposal for all three calls passes the necessary thresholds.