Coordination of the European software-defined vehicle platform

Opened

Code: 40834 | Identifier Code: HORIZON-JU-CHIPS-2026-SDV-CSA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 22/09/2026

Modern ECS are a highly complex combination of hardware and software components that exhibit intricate configurations, dependability constraints and interoperability needs. European vehicle manufacturers and suppliers are at risk of losing their competitive edge compared to their International counterparts, who are innovating at higher speed and scale.

Supply chain resilience CSA

Opened

Code: 40831 | Identifier Code: HORIZON-JU-CHIPS-2026-2-CSA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 22/09/2026

The action supports the data gathering from companies (potentially leveraging API based surveys and automated tools such as web crawling to gather publicly available information), providing them with the respective incentives to participate. Data should include both public and restricted industry data. The public data can be used to create an online catalogue of companies, products, and services in the European semiconductor supply chain.

RIA Resilience call reinforcing Europe’s strength in 6G radio communication systems

Opened

Code: 40827 | Identifier Code: HORIZON-JU-CHIPS-2026-2-RIA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals submitted to this call should address the following set of FEM constituent technologies in priority including challenges issues such as:

• Transmitter and Power amplification
• Receiver
• TRX
• Integration/packaging
• Sustainability
• Advanced Antenna System
• ISAC

IA Resilience call reinforcing Europe’s strenght in health

Opened

Code: 40824 | Identifier Code: HORIZON-JU-CHIPS-2026-FT3-IA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Integrated technologies for monitoring, imaging and biomedical research:

• Advanced wearable health technologies and integrated solutions
• Personalized imaging technologies
• Advanced laboratory and scientific solutions

Impact Monitoring and Assessment Framework for the Chips JU

Opened

Code: 40821 | Identifier Code: HORIZON-JU-CHIPS-2026-IMAF-CSA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 30/09/2026

Projects funded under this call are expected to deliver the following outcomes, which together constitute a complete and durable impact monitoring and assessment framework:

• Complete Indicator Framework: A validated indicator framework of short-term actions, outcomes and long-term impacts, for both the ECS programme and the Chips for Europe Initiative, integrating Horizon Europe indicators, common JU indicators, and Chips JU-specific indicators.
• Data Collection and Exploitation Monitoring Platform: A standardised, multi-user platform for the systematic collection of programme-level monitoring data from all Chips JU projects and key external stakeholders, covering both the periodic tracking of programme indicators and the continuous monitoring of exploitation and commercialisation progress across all active and recently closed projects.
• Scalable Impact Assessment Methodology: A documented, scalable and auditable methodology for conducting structured periodic impact assessments of the full Chips JU programme, providing the analytical framework for interpreting programme monitoring data and producing credible, comparable and externally auditable assessments of programme performance across all relevant impact dimensions.
• Governance Architecture and Operational Handover: A governance architecture for the IMAF defining the roles, responsibilities, oversight mechanisms and data management protocols that ensure the infrastructure operates with appropriate independence, credibility and institutional continuity. This shall include a full operational handover to the Chips JU office at action end.

IA Resilience call reinforcing Europe’s strength in photonics

Opened

Code: 40817 | Identifier Code: HORIZON-JU-CHIPS-2026-FT2-IA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals submitted to this call are expected to address several of the following elements:

• Scaling of wafer-level photonic processes for key materials (e.g. SiN, InP, GaAs),including process integration, yield optimisation, and manufacturability at highvolumes.

• Development of packaging and test solutions that are scalable, automated, andcompatible with co-packaged optics and advanced photonic-electronic integration.

• Integration of heterogeneous materials and components, such as on-chip lasers,modulators, and detectors, using advanced packaging and assembly approaches.

• Design-process-equipment co-optimisation, enabling repeatable, cost-effectiveproduction of complex photonic circuits and systems, including use of PDKs andvalidated building blocks.

• Demonstration of system-level functionality through application-relevant use casesin strategic sectors (e.g. AI, sensing, telecommunication, mobility, health, defence),with quantified performance metrics and clear market relevance.

Call with Digital Partnership and TTC countries

Opened

Code: 40814 | Identifier Code: HORIZON-JU-CHIPS-2026-3-RIA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

The focus needs to be on areas where Digital Partnership countries bring strong complementary expertise, including advanced packaging, heterogeneous integration, and photonic chip technologies.

IA Resilience call reinforcing Europe’s strenght in power electronics

Opened

Code: 40811 | Identifier Code: HORIZON-JU-CHIPS-2026-FT1-IA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 16/09/2026

Proposals innovations should address one or more of the several domains :

• WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions.
• WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain.
• A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes.
• Next generation or optimised new power semiconductor devices fitting their application.
• Adding intelligence to power semiconductor devices on control and/or sensor side.
• Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging.
• Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption.
• Advanced characterization techniques for new materials, devices, and systems.
• Implement AI at system level and/or make use of AI methods to increase the innovation speed.

AI chip demonstrators for EU compute infrastructure

Opened

Code: 40808 | Identifier Code: DIGITAL-JU-CHIPS-2026-AI1-SG | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 23/09/2026

The expected outcomes of this topic are :

• Functional demonstrators of working AI chip prototypes (PCB-level) designed by EU fabless companies and physically integrated with their system partners.
• Validation of AI chip solutions on a common EU evaluation platform (provided by the Topic X.B consortium), delivering comparative evidence on key performance indicators.
• A shortlist of European AI chip solutions awarded the AI Compute Excellence label and qualified to proceed to full rack development under Topic X.A2.

AI compute evaluation and deployment platform for EU infrastructure

Opened

Code: 40805 | Identifier Code: DIGITAL-JU-CHIPS-2026-AI-GFP | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 23/09/2026

The expected outcomes of this topic are :

• A common EU evaluation platform for AI chips and racks, with transparent KPIs, workloads and benchmark reports used for Chips JU selection and procurement decisions.
• First pilot deployments of European AI compute systems validated for EU sovereign partitions of AI infrastructure.
• Structured collaboration between buyers and suppliers, supporting deployment, integration and optimisation of European AI compute solutions.
• Stronger EU demand for European AI chips and racks, helping to create a market for deployment-ready solutions.
• Increased EU technological sovereignty across the AI compute stack for European datacentres.

Stimulation of Chip Design

Opened

Code: 40802 | Identifier Code: DIGITAL-JU-CHIPS-2026-SKILLS-SCD-CSA | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

This call funds a comprehensive Chip Design Skills Programme to lower barriers to entry in chip design and tape-outs.

At least 60% of the budget must support hands-on tape-out experiences (via multi-project wafers) for university and secondary school students.

Skills Hubs of Excellence

Opened

Code: 40799 | Identifier Code: DIGITAL-JU-CHIPS-2026-SKILLS-HOE-SG | Programme name: 32499 | Start submission calls: 07/07/2026 | End submission calls: 24/09/2026

This call funds the creation of specialised academic “Hubs of Excellence” in critical semiconductor technology areas (e.g. chip design, manufacturing, photonics, power electronics). Projects should build industry-aligned Bachelor, Master, and PhD programmes.