Programme Category
Programme Name
Programme Description
The European Defence Fund (EDF) is the Commission’s initiative to support collaborative defence research and development, and to foster an innovative and competitive defence industrial base.
Identifier Code
Call
Summary
Future defence systems that target information superiority, new communication capabilities, new battlefield operations, combat capabilities and inter-theatre air operations require electronic components with high performance and multiple
functionalities. Systems such as radiofrequency (RF) sensors for radars or electronic warfare systems, intelligent processing platforms or hardware-secured/cyber-secured modules need to be highly integrated and to fulfil specific military requirements. A particular challenge for defence forces is the digital control of the RF spectrum. For example, digital radar equipment will be driven mainly by components like analog-todigital converters (ADC), digital-to-analog converters (DAC), the RF frontend, which
will be mainly characterised by a transmit (high power amplifier – HPA) signal chain and a receiver (low noise amplifier – LNA) signal chain, and a robust switch, setting the mode of operation.
Detailed Call Description
The performance of such a system will not only depend on the performance of the single chips used for each component but also on the quality and efficiency of their integration into packages and the optimization of their interplay with respect to the
targeted application. Advanced packaging technologies are key to obtain compact, robust and reliable electronic components by integrating and encapsulating multiple electronic chips. The resulting Multi-Chip Modules and/or System in Packages (SiP) can provide high performance and multiple functions. Packaging with short interconnections between components minimizes parasitic elements that degrade signal integrity. This is particularly relevant for next generation radio-frequency
application (e.g., radars or electronic warfare systems). Furthermore, an advanced density of integration allows hiding sensitive signals and integrating protection features, which is relevant for anti-tamper and secure module solutions.
Packaging technologies can also increase the resilience of supply in key technology areas, reducing dependence and improve security of information by allowing the use of components of different technologies and from different sources within a quality
and security assured process. This is particularly relevant for defence applications for which securing the EU supply chains of critical electronic components is challenging due to small manufacturing volumes and potential constraints such as export
restrictions.
Call Total Budget
Financing percentage by EU or other bodies / Level of Subsidy or Loan
100%
Thematic Categories
- Information Technology
- Justice - Security
- Research, Technological Development and Innovation
Eligibility for Participation
- Central Government
- Large Enterprises
- Legal Entities
- Local Authorities
- Local Authority clusters
- Researchers/Research Centers/Institutions
- Semi-governmental organisations
- Small and Medium Enterprises (SMEs)
- State-owned Enterprises
Call Opening Date
Call Closing Date
National Contact Point(s)
Ministry of Defense
172-174 Strovolos Avenue, 2048 Strovolos, Nicosia,
website: https://mod.gov.cy/
Telephone: 22 807500
Email: defence@mod.gov.cy
Department of Research and Innovation
Phones: 22 807755, 22 807754
Email: research.innovation@mod.gov.cy
EU Contact Point
European Directorate-General for Defence Industry and Space (DEFIS)
https://ec.europa.eu/info/departments/defence-industry-and-space_en