The Chips Joint Undertaking (Chips JU) is a pioneering initiative committed to catalysing research, development, and manufacturing capabilities across Europe. In this section, we delve into the key facets of Chips JU and its mission to shape the semiconductor future of the European Union.
The Chips Joint Undertaking (JU) supports research, development, innovation, and future manufacturing capacities in the European semiconductor ecosystem.
The Lab-to-Fab Transfer Accelerator (LFA) projects prepare for a faster take-up of latest packaging technologies by the European industry. They do not cover the full lab-to-fab trajectory but prepare it and should enable a seamless fab technology transfer to industry after the end of the project.
To bring the latest advanced packaging technologies from the Chips JU pilot lines to industrial advanced packaging sites across Europe faster, the Chips Joint Undertaking will support pan-European technology transfer preparation projects to accelerate the post-project transfer from Chips JU pilot lines into key application domains.
The focus of the proposed projects should be on joint development, led by industry, of the most advanced packaging technologies with the Pilot lines to enable a future transfer of the latest packaging technologies from pilot lines into industrial production sites. The proposed projects are expected to cover the necessary value chain steps up to manufacturing, and develop industrial-grade, high-yield advanced packaging technologies including process developments up to TRL 7.
Reimbursement rates as percentages of the eligible cost according to DIGITAL
25% For profit organisation but not an SME
35% SME (for profit SME)
35% University/Other (not for profit)