Proposals for this call shall address most of the following topics in a coherent way to reach integrated demonstrators supporting the upcoming standardisation efforts on 6G:

• Investigate differentiated semiconductor technologies targeting THz connectivity (III-V on Si, FD SOI, RF SOI, advanced BiCMOS) and viable for a wide, cost-effective deployment, with target for Ft and Fmax of 500 GHz and beyond, and their optimal combination with CMOS.
• High power, high efficiency heterogeneous integration of III-V and silicon MMICs aiming for THz scalable large phased-arrays and communication systems
  • 2D, 2.5D and/or 3D integration of external InP front-end circuits (e.g. PA and LNA) with CMOS/BiCMOS beamforming transceiver chips
  • Integrated frequency extenders for communications
  •  Efficient III/V sources and receivers
• Ultra-wideband and/or ultra-high-capacity RF front-end
  • Techniques for exploit the large band available at sub-THz and THz frequencies with low power consumption
  • Channel bonding techniques, wideband RF front-ends, diversity front-ends.
• Ultra-wideband baseband interfaces and processors
  • Wideband, low power digital converters
  • Wideband analog demodulators resilient to group delay
  • Novel signal waveforms for wideband channels and mitigating (sub-)THz RF impairments
• Antennas and beamforming for sub-THz and THz to overcome the high path loss of THz bands that can be integrated by 6G networks to meet the new demanding KPIs, including any innovative technologies, e.g. – but not limited to – substrate-integrated waveguides (SIW), meta-materials for antennas, meta-materials for intelligent reflective surfaces and meta-surfaces, Novel phased-array antenna and/or system architectures,  beamforming, MIMO, sub-arrays, spare arrays, for efficient THz phased-array scaling for arrays with >>100 elements.
• Architecture and design tools and methodologies for radio front-end modules for THz communications and joint communications and sensing, including chip-package-antenna co-design, test, validation, and verification solutions.

Proposals should lay the groundwork for future deployment of 6G networks. Consequently, the Call encourages the involvement of OEMs able to provide 6G system requirements, ensuring that the prototype components developed within the selected actions can be further integrated in system-level demonstrators.